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To maintain its position at the forefront of international research, the Institute for Computational Cosmology at Durham University wanted to develop a new high-performance computing cluster - find out how they did it.
This issue of Custom Systems Magazine will discuss the recent influx of opportunities for custom system builders to enter the tablet PC market as serious competitors. Prior to the emergence of the iPad, it was difficult for system builders to get involved in the PC market, due to expensive parts and several different distribution outlets. But these days, tablet components are cheaper and easier to come by. There are more technology options to choose from, and manufacturers can purchase all their components from one distributor, allowing custom system builders and boutique PC makers to build customized tablets and still enjoy a margin to make it worth their while.
The supply chain meltdown begins due to the impact of Japan's travesty, but spending and growth is still reportedly on the rise in 2011 for integrated graphics chips. Inside this Custom Systems eZine, a market-research report forecasts that the market segment for integrated graphics chips will grow by 9 percent in 2011, shipping inside more than 63 million units globally, from 369 percent of the overall processor market last year. And while the PC market may not be the high growth opportunity it used to be, there's still plenty of business to be done around computer peripherals and custom systems. CRN's Need To Know list this month looks at a wide variety of vendors that build all of the necessary parts that compose today's computers, from the graphics cards and memory to the hard drives and chassis.
What Is CFA and Why Do I Need It? This five-part paper series examines the conditions that led to the development of recommended rules, and describes the process by which automated design analysis and rule verification can help designers optimize designs to the fullest and most efficient use of area, while still ensuring manufacturability.
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Learn how Mocana's NanoSec can speed your product development cycle while providing best-in-class device security for resource-constrained environments. Download the product whitepaper and receive a free trial.
Until recently, designing or building a wireless device meant cobbling together whatever security implementations you could find, often with open source and other code that is usually too big and too slow for device environments.
The focus of this paper is a combined electrical, thermal and optical characterization of power LED assemblies. Thermal management play important role in case of power LEDs, necessitating both physical measurements and simulation.
Today's technological innovation demands high performance coupled with low environmental impact. These dual requirements are driving components of the semiconductor industry which informs many global businesses and consumer lives.
This paper will present the case that there are a number of frailties associated with Dolby E, the
most notable of which are the latency, audio quality and general awkwardness in terms of
operation and implementation.
This paper examines the key performance aspects of low bit rate audio codecs for the next generation of bandwidth-efficient digital wireless microphone systems that meet the future needs of live events.
"As the number of enhancements to various Hardware Description Languages (HDLs) has increased over the past year, so too has the complexity of determining which language is best for a particular design. Many designers and organizations are contemplating whether they should switch from one HDL to another.
This paper compares the technical characteristics of three, general-purpose HDLs.
A powerful signal integrity analysis tool must be flexibility, easy to use and integrated into an existing EDA framework and design flow. In addition, it is important for the tool to be accurate enough. This report reviews a validation study for the Mentor Graphics HyperLynx 8.0 PI tool to establish confidence in using it for power integrity analysis.
For advanced signaling over high-loss channels, designs today are using equalization and several new measurement methods to evaluate the performance of the link. Both simulation and measurement tools support equalization and the new measurement methods, but correlation of results throughout the design flow is unclear. In this paper a high performance equalizing serial data link is measured and the performance is compared to that predicted by simulation. Then, the differences between simulation and measurements are discussed as well as methods to correlate the two.
High Density Interconnect (HDI) is being used more often to meet the growing need for more complex designs in smaller form factors. Beyond some of the more obvious electrical effects of using smaller vias, there is also an impact to the power integrity of a board using HDI. This includes different effects of mounted inductances of decoupling capacitors, changes in plane performance due to reduction in perforation from chip pinouts, and the inherent plane-capacitance changes from using dielectrics of various thicknesses. This paper will examine and quantify these effects, using numerous design examples, including a large conventional through-hole design board that was reduced using HDI.